Reflow Ovens
Reflow ovens are essential machines used in surface-mount technology (SMT) to solder electronic components onto printed circuit boards (PCBs). The process involves heating the entire PCB assembly to melt solder paste applied during the stencil printing stage. Reflow ovens typically have multiple heating zones—preheat, soak, reflow, and cooling—each precisely controlled for optimal temperature profiles. This ensures uniform soldering, minimizes thermal stress, and prevents defects like cold joints or tombstoning. Modern reflow ovens support lead-free soldering and feature nitrogen atmosphere options for oxidation-free results. They are widely used in high-volume electronics manufacturing for consistent, reliable, and automated soldering performance.
Heller 1809MKIII
The Heller 1809MKIII is a high-performance SMT reflow oven featuring 9 top and bottom heated zones, ensuring uniform temperature profiles for lead-free soldering. With a heated length of 100 inches and dual internal cooling zones, it offers efficient thermal management.
Vitronics XPM820
The Vitronics Soltec XPM2-820 is a high-performance, lead-free reflow oven designed for precision and efficiency in Surface Mount Technology (SMT) production lines. With its robust construction and advanced features, it ensures consistent soldering quality for various PCB assemblies.